Optimization of silicon etching process using response surface method
-
摘要: 利用响应面分析方法优化了用于压力传感器硅敏感芯体的刻蚀操作条件。主要考虑了温度、KOH浓度和腐蚀时间三个操作参数，将它们的范围分别设定为40~60 ℃，0.4~0.48 mol/L 和 5~12.5 h，并设定各向异性腐蚀速率为响应值。通过建立二次方模型，分析这些参数的单独影响以及多个操作条件之间对腐蚀速率的相互交叠作用。分析结果表明：模型可以精确预测99%的响应值，相比于腐蚀时间，溶液浓度和工作温度对刻蚀速率的影响更为明显。Abstract: In this paper, the response surface methodology(RSM) is applied to optimizing the operating conditions of silicon etching for pressure sensor fabrication. Three operating parameters, the temperature, the KOH concentration and the etching time are considered in this study, and the ranges of them are 40-60℃, 0.4-0.48 mol/L and 5-12.5 h, respectively. A quadratic model is established to describe the anisotropic etching rate as the response value, and the individual effects of these operating parameters and the combined effects of multiple operating conditions on etching rate are examined.
-
Key words:
- KOH anisotropic /
- response surface methodology /
- etching rate /
- sensor
-
点击查看大图
计量
- 文章访问数: 1113
- HTML全文浏览量: 210
- PDF下载量: 276
- 被引次数: 0
下载:
