Abstract: A V-shaped Silicon microchannel cooler has an advantage of packaging compact laser diode arrays due to its high cooling power and specific structure. The structure and fabrication process of the V-shaped silicon microchannel cooler are reported. The cooler contains a silicon wafer and a glass manifold. The silicon wafer contains V-shaped grooves and microchannels of 30 μm wide which are etched by anisotropic etching after being photolithed. The whole cooler is formed by bonding silicon wafer to glass manifold. Some coolers were fabricated and tested. The results show that it has a thermal impedance of 0.051 ℃·cm2/W for the single groove facet that match the results of numerical simulation. The cooler meets the requirement for packaging laser diode arrays with a peak power density up t