Investigation of vapor deposited polymerized polyimide capsule on deposition uniformity and properties
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摘要: 为满足惯性约束聚变(ICF)对聚酰亚胺(PI)靶丸的要求，研究了气相沉积过程单体加热温度对PI薄膜厚度的影响并测试其均匀性，测试了脉冲敲击模式下复合微球的表面质量。研究了薄膜热环化过程中的结构变化，并对所得PI薄膜进行了热稳定性分析。研究结果表明：脉冲敲击下制备所得复合微球表面粗糙度均方根值波动在29~45 nm之间，在相同时间内其薄膜厚度随单体加热温度的增加而增加，通过调节不同单体加热温度，可将薄膜厚度控制在一定范围；薄膜厚度测试发现其较为均匀，横向和纵向各点厚度相差不足1 m；热环化后聚酰胺酸转化为PI，CONH与COOH结合形成C-N键；热重分析数据显示PI薄膜热稳定性较好，600 ℃左右才开始大量分解。Abstract: To satisfy requirement of polyimide(PI) capsules for inertial confinement fusion (ICF) targets, influence of monomer heating temperature on the thin film, thickness uniformity and surface quality of shells treated by impulse tapping, configuration of PI after curing process and heating stabilization were investigated. The results show that composite shells root-mean-square value ranged from 29 nm to 45 nm by impulse tapping, which is close to ICF standard. The thickness of films is less than 1 m in both vertical and lateral directions, which is uniform. After the curing process, PAA is converted to PI. CONH is combined with COOH to form C-N. The thermal stability of films is well, which greatly deforms at 600 ℃ and still reserves 20% at 900 ℃.
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Key words:
- polymide capsule /
- surface quality /
- structure /
- thermal stability
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