芯片-系统电磁脉冲耦合的高性能全波电磁模拟

王卫杰; 赵振国; 胡少亮; 李瀚宇; 周海京

doi:10.11884/HPLPB202133.210359

芯片-系统电磁脉冲耦合的高性能全波电磁模拟

doi: 10.11884/HPLPB202133.210359

王卫杰^{1, 2, 3,},
赵振国^{1, 2, 3, 4},
胡少亮^{1, 2},
李瀚宇^{1, 2, 3},
周海京^{1, 2, 3, ,}

1.
中物院高性能数值模拟软件中心, 北京 100088
2.
北京应用物理与计算数学研究所, 北京 100094
3.
中国工程物理研究院复杂电磁环境科学与技术重点实验室, 四川绵阳 621900
4.
复旦大学专用集成电路与系统国家重点实验室, 上海 201203

基金项目: 国家自然科学基金项目（12001053）；中物院创新发展基金项目（CX2019034）；国防基础科研计划资助课题（TZ2018002）

详细信息

作者简介:
王卫杰，wang_weijie@iapcm.ac.cn

通讯作者:
周海京，zhou_haijing@iapcm.ac.cn

中图分类号: TN248.6
计量
- 文章访问数: 780
- HTML全文浏览量: 330
- PDF下载量: 82
- 被引次数: 0
出版历程
- 收稿日期: 2021-08-19
- 修回日期: 2021-11-18
- 网络出版日期: 2021-12-07
- 刊出日期: 2021-12-15

High-performance full-wave computational electromagnetic analysis for chip-system under electromagnetic pulse

Wang Weijie^{1, 2, 3
,},
Zhao Zhenguo^{1, 2, 3, 4},
Hu Shaoliang^{1, 2},
Li Hanyu^{1, 2, 3},
Zhou Haijing^{1, 2, 3
, ,}

1.
CAEP Software Center for High Performance Numerical Simulation, Beijing 100088, China
2.
Institute of Applied Physics and Computational Mathematics, Beijing 100094, China
3.
Key Laboratory of Science and Technology on Complex Electromagnetic Environment, CAEP, Mianyang 621900, China
4.
State Key Laboratory of ASIC & System, Fudan University, Shanghai 201203, China

摘要

摘要: 目的是研究高性能的电磁场仿真软件，对真实的芯片-系统电磁脉冲耦合过程进行高分辨率、高置信度的电磁仿真。研究重点是针对多尺度问题，突破算法的并行计算瓶颈。基于自主软件平台快速研发出仿真软件，在高性能计算平台上完成对真实复杂问题的全波电磁仿真。通过对某真实机箱内部芯片的电磁脉冲耦合仿真分析，验证了本文提出的算法的高性能、高效率的特性。
- 芯片-系统 /
- 电磁脉冲 /
- 多尺度 /
- 有限元方法 /
- 并行计算
Abstract: The objective of this work is to investigate high-performance electromagnetic field finite element solver towards high resolution and high fidelity electromagnetic simulations of product-level ICs and electronics. The emphasis of this work is to overcome the parallel bottleneck of multiscale problems and fulfill full-wave electromagnetic simulation of complex problems. Numerical simulation software can be developed quickly based on our software-platform. Finally, the capability and benefits of the algorithms are validated and illustrated through practical simulation of chip in computer case.
- chip-system /
- electromagnetic pulse /
- multiscale problem /
- finite element method /
- parallel computing

HTML全文

图 1 并行编程框架JAUMIN架构图

Figure 1. Software architecture of parallel programming framework JAUMIN

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图 2 软件平台架构框图

Figure 2. Software platform

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图 3 平面波照射介质体内部电场变化与商业软件对比结果

Figure 3. Comparison of calculated results with commercial software of electric field variation of a dielectric box under plane wave

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图 4 偶极子天线S参数计算结果与商业软件对比

Figure 4. S parameter calculation compared with commercial software

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图 5 偶极子天线示意图

Figure 5. Geometrical illustration of a dipole antenna

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图 6 芯片-系统示意图

Figure 6. Schematic illustration of chip-system model

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图 7 输入电磁脉冲波形

Figure 7. Waveform of input pulse

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图 8 有机箱屏蔽不同时刻机箱与芯片电磁脉冲耦合的结果

Figure 8. Coupling effect of computer case and chip at different simulation time

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图 9 无机箱屏蔽不同时刻芯片电磁脉冲耦合的结果

Figure 9. Coupling effect of chip without computer case at different simulation time

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图 10 待监测系统级封装芯片端口分布示意图

Figure 10. Lumped port distribution of system-in-package

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图 11 不同端口监测到的端口电压频域分布

Figure 11. Port voltage of the listed 20 ports in frequency domain

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表 1 芯片材料信息

Table 1. Material properties of Chip

	relative permittivity	relative permeability	bulk conductivity	dielectric loss tangent
Al₂_O₃_ceramic	9.8	1.0	0.0	0.0
aluminum	1	1	3.8×10⁷	−
copper	1.0	1.0	5.8×10⁷	−
gallium_arsenide	12.9	1.0	1.0	0.0
gold	1.0	1.0	4.1×10⁷	−
rogers RO4350 (tm)	3.66	1.0	0.0	0.004
silicon	11.9	1.0	0.0	0.0

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表 2 并行计算参数

Table 2. Parallel computing information

number of grids	number of CPU cores	center frequency/GHz	time step/s	total simulation time/s
10 000 000	120	1.0	2.0×10⁻¹¹	10.0×10⁻⁸

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表 3 不同时刻耦合电场的最大值

Table 3. Maximum value of electric fieldat different time

time/ns	with computer box shielding/（V·m⁻¹）	without computer box shielding/（V·m⁻¹）
0.4	0.1860	0.4674
5.2	9.014	54.68
10	39.36	917.8

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