Demonstration of on-wafer solid-state high-power microwave with field-range product of 20 kV
-
摘要: 随着低空经济产业加速发展，低空安防日益引起广泛关注。我们提出了一种片上固态高功率微波新思路，并在单个厚度0.5 mm、直径0.15 m的半导体晶圆上集成了储能电容、高功率光控半导体开关及天线，实现了辐射因子20 kV的超宽谱高功率微波输出。实验表明，基于集成化片上高功率微波系统，对10 m处的消费级无人机造成了通信链路切断及飞行失控的效果。Abstract:
Background As the low-altitude economy industry accelerates, low-altitude security has attracted increasing attention. High-power microwave (HPM) is one of the important means to address the security threats posed by non-cooperative unmanned aerial vehicles (UAVs).Purpose As a type of high-power electromagnetic pulse, ultra-wideband high-power microwave (UWB-HPM) can attack the electronic information systems of non-cooperative UAVs through “front-door” or “back-door” coupling, resulting in effects such as interference, disruption, damage, and burnout.Methods We propose a new concept of on-wafer high-power microwave on wafer (HPM on-wafer), which integrates energy storage capacitors, high-power optically controlled semiconductor switches, and antennas on a single semiconductor wafer with a thickness of 0.5 mm and a diameter of 0.15 m.Results The unit of HPM on-wafer achieves an ultra-wideband high-power microwave output with a radiation factor of 20 kV.Conclusions Experiments show that based on this integrated HPM on-wafer unit, the communication link of a consumer-grade UAV at a distance of 10 m is cut off and the UAV loses flight control. By arranging and combining the basic units of HPM on wafer, modular expansion can be realized to form ultra-wideband high-power microwave systems of different scales, which can meet the requirement of achieving the intended strike effect on different platforms. -
[1] 郭辰阳, 敖万忠, 吕宜宏. 充分把握发展机遇, 加快推进低空经济高质量发展[J]. 财经界, 2022(25): 36-38Guo Chenyang, Ao Wanzhong, Lv Yihong. Money China, 2022(25): 36-38 [2] 赵刚. 低空经济安全防护研究与应用[J]. 电信工程技术与标准化, 2025(2): 1-6Zhao Gang. Research on low altitude economic security protection[J]. Telecom Engineering Technics and Standardization, 2025(2): 1-6 [3] 令钧溥, 王蕾, 皮明瑶, 等. 美国反无人机高功率微波技术研究现状及启示[J]. 国防科技, 2023(6): 74-80Ling Junpu, Wang Lei, Pi Mingyao, et al. High-power microwave technology countering UAVs in the United States: research status and implications[J]. National Defense Technology, 2023(6): 74-80 [4] 张帅, 张艺博, 涂敏. 浅析美国高功率微波效应研究动态[J]. 强激光与粒子束, 2024, 36: 013001 doi: 10.11884/HPLPB202436.230304Zhang Shuai, Zhang Yibo, Tu Min. Brief analysis of research trends of high power microwave effect in the United States[J]. Hiigh Power Laser and Particle Beams, 2024, 36: 013001 doi: 10.11884/HPLPB202436.230304 [5] Li Yangfan, Xiao Longfei, Luan Chongbiao, et al. Ultrafast characteristics of integrated high-power photoconductive semiconductor switch based on 4H-SiC substrate[J]. IEEE Transactions on Electron Devices, 2025, 72(1): 128-134. doi: 10.1109/TED.2024.3492149 -
下载:
点击查看大图
图(2)
计量
- 文章访问数: 307
- HTML全文浏览量: 59
- PDF下载量: 92
- 被引次数: 0
