Preparation and characterization of low-density Cu-doped SiO2 composite aerogels
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摘要: 分别以正硅酸甲酯、醋酸铜为硅源和铜源，通过溶胶凝胶法及CO2超临界干燥技术制备了一系列Cu掺杂SiO2复合气凝胶。采用红外谱仪（FTIR）、扫描电镜（SEM）、X射线能谱仪（EDS）、比表面积和孔隙度分析仪（BET）、动态热机械分析仪（DMA）对样品进行了表征。结果表明随着铜含量的增加，复合气凝胶密度增加，比表面积降低，平均孔径增加，实际掺杂比与理论掺杂比对应增加。该复合气凝胶具有三维网状结构，密度低（＜40 mg/cm3），比表面积高（＞390 m2/g），成型性较好，有望应用于惯性约束聚变（ICF）实验。
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关键词:
- Cu掺杂SiO2复合气凝胶 /
- 溶胶凝胶法 /
- 超临界干燥 /
- 惯性约束聚变
Abstract: The Cu-doped SiO2 composite aerogels with different Cu doping content were successfully prepared by sol-gel process and subsequently supercritical drying with carbon dioxide. Tetramethyl orthosilicate and copper (Ⅱ) acetate were used as Si source and Cu source, respectively. The structures and properties of the composite aerogels were characterized by FTIR, SEM, EDS, BET and DMA. With the increase of the content of copper, the density of the composite aerogels increased and the specific surface area decreased. All of the samples processed a structure of 3-D network, low density (less than 40 mg/cm3), high specific surface area (more than 390 m2/g) and fine formability. -
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