Experimental investigation on diode laser bonding based on mini-bars

Packaging technology for semiconductor laser diodes influences significantly on their output characteristics, such as lifetime. Selections of solders and welding process are very important. Using a semi-automatic welding system, mini-bar was directly welded on Cu heat sink with indium solder. By improving the welding system, optimizing software and slowing imaging procedures, the welding with high accuracy and high reliability was achieved. Measurements of the laser performances show that power for the welding is stable, its welded precision is 20 m, smile effect can be controlled less than 0.5 m.