Study of current density distribution in terahertz device micro-electroforming process

Zhao Xinyue; Ji Shengwei; Lu Yiru; Liu Yubao; Huang Bo; Wang Xiaokang

doi:10.11884/HPLPB201931.190067

Volume 31 Issue 8

Aug. 2019

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Article Navigation > High Power Laser and Particle Beams > 2019 > 31(8): 083102

Zhao Xinyue, Ji Shengwei, Lu Yiru, et al. Study of current density distribution in terahertz device micro-electroforming process[J]. High Power Laser and Particle Beams, 2019, 31: 083102. doi: 10.11884/HPLPB201931.190067

Citation:

Zhao Xinyue, Ji Shengwei, Lu Yiru, et al. Study of current density distribution in terahertz device micro-electroforming process[J]. High Power Laser and Particle Beams, 2019, 31: 083102. doi: 10.11884/HPLPB201931.190067

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Study of current density distribution in terahertz device micro-electroforming process

doi: 10.11884/HPLPB201931.190067

Zhao Xinyue^{1, 2
,},
Ji Shengwei^{1, 2},
Lu Yiru³,
Liu Yubao^{1, 4},
Huang Bo^{1, 2},
Wang Xiaokang^{1, 2}

1.
Academy of Photoelectric Technology, Hefei University of Technology, Hefei 230009, China
2.
School of Instrument Science and Opto-electronics Engineering, Hefei University of Technology, Hefei 230009, China
3.
AVIC Photoelectric Technology Co, Ltd, Luoyang 471000, China
4.
School of Electronic Science and Applied Physics, Hefei University of Technology, Hefei 230009, China

Received Date: 2019-03-08
Rev Recd Date: 2019-04-21
Publish Date: 2019-08-15

Abstract

Abstract

Micro-electroforming is a key step of terahertz all-metal devices microfabrication, in which metal-ion deposit uniformity determines the grating's quality.Meanwhile, the deposit uniformity is influenced by the distribution of current density near the cathode.The current density distribution in copper micro-electroforming is investigated by method of FIT (finite integration technique) simulation analysis and experimental verification.By adding aglass baffle panel between anode and cathode, the current density uniformity can be improved.The effect of the distance between panel and cathode and the size of hole in baffle panel on current density uniformity is analyzed thoroughly.The nearer the panel is to the cathode, the more uniform the current density of the cathode, which can significantly improve the uniformity of deposit in microstructure.According to the simulation results, a baffle panel with a 2.5 cm×2.5 cm gap is fabricated and placed between the anode and the cathode with a 100 mm distance from the cathode.Then electroforming was carried out and a better quality metal layer with finer and more uniform grain was gained, which proved the simulation results.
- micro-electroforming,
- terahertz,
- baffle panel,
- current density

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References(13)

References

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