Fabrication technology of Au80Sn20 alloy solder

For the packaging demand of high power diode laser, the method of magnetron sputtering was used to fabricate the Au80Sn20 alloy solder. A scanning electron microscope (SEM) was adopted to observe its microstructure and surface topography, an energy dispersive X-ray detector(EDX) to test its composition, and the differential thermal analysis (DTA) to test its melting temperature. The weldability of the Au80Sn20 alloy solder was analyzed by reflow soldering process. In conclusion, using magnetron sputtering can successfully manufacture the Au80Sn20 alloy solder. The prepared Au80Sn20 alloy solder features compact surface structure, easy wetting, small void content, and large bonding strength. Its composition and melting point are close to the theoretical situation.