Volume 25 Issue 02
Dec.  2012
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Yang Bo, Zhou Xiuwen, He Wei, et al. Adhesives for assemblage of Z-pinch dynamic hohlraum load[J]. High Power Laser and Particle Beams, 2013, 25: 389-393. doi: 10.3788/HPLPB20132502.0389
Citation: Yang Bo, Zhou Xiuwen, He Wei, et al. Adhesives for assemblage of Z-pinch dynamic hohlraum load[J]. High Power Laser and Particle Beams, 2013, 25: 389-393. doi: 10.3788/HPLPB20132502.0389

Adhesives for assemblage of Z-pinch dynamic hohlraum load

doi: 10.3788/HPLPB20132502.0389
  • Received Date: 2012-04-22
  • Rev Recd Date: 2012-09-29
  • Publish Date: 2013-02-10
  • The low-density foam of Z-pinch dynamic hohlraum has special requirements to the adhesive because of its porous structure and low mechanical intensity. The present paper reports the preparation of ultraviolet curable adhesives applicable for low-density foam using polyurethane acrylate as prepolymer and isobornyl acrylate as activator diluent. The adhesives were compounded by mixing the prepolymer, diluent with photoinitiator and coupling agent. The test results indicate that the volume shrinkage of a prepared adhesive is only 2.25%, the adhesives have quick curing speed and adequate shear strength to meet the requirements of assemblage. According to the interface observation, there are few adhesives entering the diagnose hole, and the diffuse thickness of adhesives in foam is small and uniform.
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