Multiplayer bonding technique for high power diode laser package

gao song-xin; wu de-yong; wang jun; tang chun

Volume 15 Issue 05

May 2003

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gao song-xin, wu de-yong, wang jun, et al. Multiplayer bonding technique for high power diode laser package[J]. High Power Laser and Particle Beams, 2003, 15.

Citation:

gao song-xin, wu de-yong, wang jun, et al. Multiplayer bonding technique for high power diode laser package[J]. High Power Laser and Particle Beams, 2003, 15.

gao song-xin, wu de-yong, wang jun, et al. Multiplayer bonding technique for high power diode laser package[J]. High Power Laser and Particle Beams, 2003, 15.

Citation:

gao song-xin, wu de-yong, wang jun, et al. Multiplayer bonding technique for high power diode laser package[J]. High Power Laser and Particle Beams, 2003, 15.

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Multiplayer bonding technique for high power diode laser package

1.
Institute of Applied Electronics,CAEP,P.O.Box 919-1013,Mianyang 621900,China;
2.
Department of Optical Engineering,Zhejiang University,Hangzhou 310027,China

Publish Date: 2003-05-15

Abstract

Abstract

The bonding technique of high power diode laser package is studied and the method of making indium solder with evaporating deposition in high vacuum is mastered. The multiplayer bonding experiment is carried out without scaling powder. The performances of packaged CW and QCW lasers are measured. The experiment's results show that multilayer bonding technique with indium and InSn alloy for laser package is practical.
- indium solder,
- in-sn alloy,
- soldering,
- heat sink