xie jun, wu wei-dong, ye cheng-gang, et al. Vacuum diffusion bonding technology of aluminum/copper films[J]. High Power Laser and Particle Beams, 2004, 16.
Citation:
xie jun, wu wei-dong, ye cheng-gang, et al. Vacuum diffusion bonding technology of aluminum/copper films[J]. High Power Laser and Particle Beams, 2004, 16.
xie jun, wu wei-dong, ye cheng-gang, et al. Vacuum diffusion bonding technology of aluminum/copper films[J]. High Power Laser and Particle Beams, 2004, 16.
Citation:
xie jun, wu wei-dong, ye cheng-gang, et al. Vacuum diffusion bonding technology of aluminum/copper films[J]. High Power Laser and Particle Beams, 2004, 16.
According to the requirement of the ICF experiments, the vacuum diffusion bonding of the aluminum and copper films were studied in high temperature circumstances(250℃). The microstructures of the joint and surface roughness are analyzed by means of SEM, XRD and an alpha-step device. The results show that the force among atoms, metallurgy combination and interface reaction are important to obtain the high quality joint of the aluminum and copper films.