cai hongmei, wu weidong, zhang lin, et al. Visual inspection technology of Z-pinch wire-array assembly parameters[J]. High Power Laser and Particle Beams, 2010, 22.
Citation:
cai hongmei, wu weidong, zhang lin, et al. Visual inspection technology of Z-pinch wire-array assembly parameters[J]. High Power Laser and Particle Beams, 2010, 22.
cai hongmei, wu weidong, zhang lin, et al. Visual inspection technology of Z-pinch wire-array assembly parameters[J]. High Power Laser and Particle Beams, 2010, 22.
Citation:
cai hongmei, wu weidong, zhang lin, et al. Visual inspection technology of Z-pinch wire-array assembly parameters[J]. High Power Laser and Particle Beams, 2010, 22.
The use of visual inspection and image processing technology has implemented the automatic, continuous and non-destructive inspection of 5 μm tungsten wire-array assembly parameters, i.e., the straightness of single wire, the distance between two contiguous wires, and whether foreign body and rupture exist. Image collection and configuration method of this visual inspection system is studied, and a visual inspection experiment system has been built for inspecting Z-pinch wire-array assembly parameters. The results show that the system has the optimal inspection precision of 2 μm and can inspect foreign body and rupture on wires, which can meet the requirement of assembly parameter inspection for Z-pinch wire-arrays.
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