Electroless plating and characteristics of hohlraum Cu target

This paper introduces the electroless plating technique to fabricate integral hohlraum Cu target. Catalyzed by the metal surface of the pretreated PMMA axis, the reducing reaction deposits Cu on the axis and then the axis is etched and the surface passivation of the Cu plating is performed. Cu target obtained by this technique can meet the requirements of ICF targets,which has:(1) a surface of no porosity and no crackle; (2) a 17μm thick wall which can retain it's erectile form; (3) a plating of even thichness and of 99.2% Cu content; (4) the passivated surfae which shows no obvious change in 4 weeks. This fabrication technique provides a way to make other metal and alloy integral hohlraum targets for ICF.