Metallization and sealing technology of quartz vacuum window film
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摘要: 面向超高真空精密光学系统的迫切需求,对高性能石英真空窗的封接技术展开系统性研究。石英虽具备优异透光性,但其与金属封接时因热膨胀系数差异较大导致的界面应力集中与真空密封失效,一直是制约低漏率石英真空窗制备的关键技术瓶颈。针对这一难题,提出采用磁控溅射技术在石英焊接面依次沉积Ti/Mo/Cu/Ag多层膜系,构建具有热应力缓冲能力的梯度功能金属化层,实现了石英表面的有效金属化。扫描电镜观察表明,所制备膜层连续致密、结构均匀;纳米压痕实验进一步测得金属化层与石英基底的结合强度约为3.83 N,表明膜层附着牢固可靠。实验结果表明:基于该金属化方案所制备的真空窗口组件,其漏率低于10−12 Pa·L/s。该成果可广泛应用于同步辐射、量子测量及空间探测等领域,为高性能真空器件的发展提供关键技术支撑。Abstract:
Background Although quartz exhibits excellent light transmittance, the significant difference in thermal expansion coefficients between quartz and metal sealing materials has long been a critical technical bottleneck, leading to interface stress concentration and vacuum sealing failures in low-leakage quartz windows.Purpose This study addresses the urgent demand for ultra-high vacuum precision optical systems by conducting systematic research on sealing technologies for high-performance quartz vacuum windows.Methods To overcome this challenge, this paper innovatively proposes using magnetron sputtering technology to sequentially deposit a Ti/Mo/Cu/Ag multilayer film system on the quartz welding surface, thereby creating a gradient functional metallization layer with thermal stress buffering capability that achieves effective surface metallization.Results Scanning electron microscopy observations revealed continuous, dense, and structurally uniform film layers. Nanoindentation experiments further demonstrated a bonding strength of approximately 3.83 N between the metallized layer and quartz substrate, indicating robust adhesion. Experimental results show that vacuum window components fabricated using this metallization scheme achieve leakage rates below 10−12 Pa·L/s.Conclusions This achievement has broad applications in synchrotron radiation, quantum measurement, and space exploration, providing crucial technical support for the development of high-performance vacuum devices.-
Key words:
- quartz glass /
- vacuum brazing /
- magnetron sputtering /
- vacuum window /
- optoelectronic devices
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表 1 各层材料的物理参数
Table 1. Physical parameters of materials
material hermal
expansivity/℃coefficient of heat
conduction/(W·m−1·K−1)Young modulus/
GPaquartz glass 0.59×10−6 1.8 70 Ti 10.5×10−6 20 70 Mo 5.8×10−6 95 245 Cu 19.5×10−6 90 30 Ag 22.5×10−6 100 15 -
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