大功率半导体激光器光谱合束光栅热效应分析

傅博文; 章勤男; 田勇; 田劲东

doi:10.11884/HPLPB202234.210271

大功率半导体激光器光谱合束光栅热效应分析

doi: 10.11884/HPLPB202234.210271

傅博文^{1, 2,},
章勤男^{1, 2},
田勇¹,
田劲东^{1, 2, ,}

1.
深圳大学物理与光电工程学院，广东深圳 518061
2.
深圳市智造激光技术研究院，广东深圳 518107

基金项目: 广东省重点领域研发计划资助项目（2020B090922005）; 国家自然科学基金面上项目（62075140）

详细信息

作者简介:
傅博文，1910454038@email.szu.edu.cn

通讯作者:
田劲东，jindt@szu.edu.cn

中图分类号: TN248.4
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- 被引次数: 0
出版历程
- 收稿日期: 2021-10-06
- 修回日期: 2021-10-30
- 录用日期: 2021-11-11
- 网络出版日期: 2021-11-17
- 刊出日期: 2022-01-13

Analysis of thermal effect of high-power semiconductor laser spectral combining grating

Fu Bowen^{1, 2
,},
Zhang Qinnan^{1, 2},
Tian Yong¹,
Tian Jindong^{1, 2
, ,}

1.
College of Physics and Optoelectronic Engineering, Shenzhen University, Shenzhen 518061, China
2.
Research Institute of Laser Processing Technology and Intelligent Manufacturing, Shenzhen 518107, China

摘要

摘要: 提出了一种大功率半导体激光器光谱合束光栅仿真模型。该模型针对光谱合束中的核心器件光栅的光-热-应力变化特性进行了分析。数值分析结果表明，当激光巴条功率为200 W，自然对流系数为10 W·(m²·K)⁻¹时，衍射光栅上温度最高点可升高至346.52 K，应力最高点可升高至0.4825 Pa，光栅表面变量最高为52.28 nm/mm，这将会使得反馈光束中心位置发生0.25～0.3 mm的偏移，从而影响激光功率以及合束效率。减少衍射光栅基底厚度，在相同激光光源条件下工作，温度、应力、面形以及应变的变化均能有效抑制，这与实验结果具有较高的一致性。该方法为大功率半导体激光器的结构设计和光学器件的测试分析提供了有效的多物理场分析，为激光器设计和测试提供了综合分析数值模型。
- 光谱合束 /
- 半导体激光器 /
- 衍射光栅 /
- 多物理场 /
- 数值模型
Abstract: This paper presents a simulation model of a high-power semiconductor laser beam combining grating. This model analyzes the optical-thermal-stress change characteristics of the core device grating in the spectrum combining. The numerical analysis results show that when the power of the laser bar is 200 W and the natural convection coefficient is 10 W·(m²·K)⁻¹, the highest temperature on the diffraction grating can be increased to 346.52 K, and the highest stress point can be increased to 0.4825 Pa, The maximum deformation per millimeter of the grating surface is 52.28 nm, which will cause the center position of the feedback beam to shift by 0.25 to 0.3 mm, which will affect the laser power and beam combining efficiency. By reducing the thickness of the diffraction grating substrate and working under the same laser light source conditions, the changes in temperature, stress, surface shape and strain can be effectively suppressed, which is consistent with the experimental results. This method provides an effective multi-physics analysis method for the structural design of high-power semiconductor lasers and the testing and analysis of optical devices, and provides a comprehensive analysis numerical model for laser design and testing.
- spectral beam combining /
- semiconductor laser /
- diffraction grating /
- multiphysics /
- numerical model

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图 1 激光器结构示意图

Figure 1. Schematic diagram of laser structure

下载: 全尺寸图片幻灯片

图 2 衍射光栅周期性结构

Figure 2. Periodic structure of diffraction grating

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图 3 衍射光栅基底几何模型

Figure 3. The geometric model of the diffraction grating substrate

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图 4 大功率半导体激光器光谱合束COMSOL实施流程图

Figure 4. Flow chart of high-power semiconductor laser spectrum combining COMSOL implementation

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图 5 光热仿真结果

Figure 5. Light thermal simulation results

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图 6 10 min时应力及形变分布云图

Figure 6. Stress and deformation nephogram at 10 min

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图 7 不同厚度衍射光栅中心点应力及形变变化曲线

Figure 7. Variation curves of stress and deformation at the center of diffraction grating with different thickness

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图 8 光栅表面各方向形变及−1级衍射效率变化曲线

Figure 8. Grating surface deformation in each direction and −1 order diffraction efficiency variation curves

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图 9 光束角度及位置偏移仿真结果

Figure 9. Simulation results of beam angle and position offset

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表 1 线栅单元周期性边界参数

Table 1. Periodic boundary parameters of wire grid unit

grating period d/nm	microstructure height h/nm	microstructure width w/nm	air refractive index n₀	incident angle θ/(°)
625.0	1725.0	400.0	1.0	θ_i(i=1,2,3,4,5)

下载: 导出CSV

表 2 常见衍射光栅基底材料物理参数

Table 2. Physical parameters of common diffraction grating substrate materials

material	n	κ	k/[W·(m·K)⁻¹]	ρ/kg·m⁻³	C_p/[J·(kg·K)]	α/K⁻¹	E/MPa	μ
quartz glass	1.508	2.89×10⁻⁸	1.38	2203	703	5.5×10⁻⁷	7.31×10⁴	0.17
Y₃Al₅O₁₂	1.816	—	11.06	4551	1582.7	6.94×10⁻⁶	2.86×10⁵	0.25
Si(100)	3.579	7.49×10⁻⁴	152.46	2330	707.12	2.57×10⁻⁶	1.31×10⁵	0.28

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