Demonstration of on-wafer solid-state high-power microwave with field-range product of 20 kV

As the low-altitude economy industry accelerates, low-altitude security has attracted increasing attention. High-power microwave (HPM) is one of the important means to address the security threats posed by non-cooperative unmanned aerial vehicles (UAVs).

As a type of high-power electromagnetic pulse, ultra-wideband high-power microwave (UWB-HPM) can attack the electronic information systems of non-cooperative UAVs through “front-door” or “back-door” coupling, resulting in effects such as interference, disruption, damage, and burnout.

We propose a new concept of on-wafer high-power microwave on wafer (HPM on-wafer), which integrates energy storage capacitors, high-power optically controlled semiconductor switches, and antennas on a single semiconductor wafer with a thickness of 0.5 mm and a diameter of 0.15 m.

The unit of HPM on-wafer achieves an ultra-wideband high-power microwave output with a radiation factor of 20 kV.

Experiments show that based on this integrated HPM on-wafer unit, the communication link of a consumer-grade UAV at a distance of 10 m is cut off and the UAV loses flight control. By arranging and combining the basic units of HPM on wafer, modular expansion can be realized to form ultra-wideband high-power microwave systems of different scales, which can meet the requirement of achieving the intended strike effect on different platforms.