Demonstration of on-wafer solid-state high-power microwave with field-range product of 20 kV

Luan Chongbiao; Yuan Jianqiang; Xiao Longfei; Liu Hongwei; Li Hongtao; Geng Lidong; He Yang; Yang Jie; Sun Xun; Li Yangfan; Xu Xiangang

doi:10.11884/HPLPB202537.250338

Volume 37 Issue 12

Nov. 2025

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Luan Chongbiao, Yuan Jianqiang, Xiao Longfei, et al. Demonstration of on-wafer solid-state high-power microwave with field-range product of 20 kV[J]. High Power Laser and Particle Beams, 2025, 37: 123001. doi: 10.11884/HPLPB202537.250338

Citation:

Luan Chongbiao, Yuan Jianqiang, Xiao Longfei, et al. Demonstration of on-wafer solid-state high-power microwave with field-range product of 20 kV[J]. High Power Laser and Particle Beams, 2025, 37: 123001. doi: 10.11884/HPLPB202537.250338

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Demonstration of on-wafer solid-state high-power microwave with field-range product of 20 kV

doi: 10.11884/HPLPB202537.250338

1.
Institute of Fluid Physics, CAEP, Mianyang 621900, China
2.
Institute of Novel Semiconductors, Shandong University, Ji’nan 250100, China

Received Date: 2025-10-11
Accepted Date: 2025-11-03
Rev Recd Date: 2025-11-02

Available Online: 2025-11-03

Publish Date: 2025-12-15

Abstract

Abstract

Background
As the low-altitude economy industry accelerates, low-altitude security has attracted increasing attention. High-power microwave (HPM) is one of the important means to address the security threats posed by non-cooperative unmanned aerial vehicles (UAVs).
Purpose
As a type of high-power electromagnetic pulse, ultra-wideband high-power microwave (UWB-HPM) can attack the electronic information systems of non-cooperative UAVs through “front-door” or “back-door” coupling, resulting in effects such as interference, disruption, damage, and burnout.
Methods
We propose a new concept of on-wafer high-power microwave on wafer (HPM on-wafer), which integrates energy storage capacitors, high-power optically controlled semiconductor switches, and antennas on a single semiconductor wafer with a thickness of 0.5 mm and a diameter of 0.15 m.
Results
The unit of HPM on-wafer achieves an ultra-wideband high-power microwave output with a radiation factor of 20 kV.
Conclusions
Experiments show that based on this integrated HPM on-wafer unit, the communication link of a consumer-grade UAV at a distance of 10 m is cut off and the UAV loses flight control. By arranging and combining the basic units of HPM on wafer, modular expansion can be realized to form ultra-wideband high-power microwave systems of different scales, which can meet the requirement of achieving the intended strike effect on different platforms.
- low-altitude security,
- on-wafer high-power microwave,
- photoconductive semiconductor switch,
- anti-drone

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References(5)

References

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