Fabrication technology of Al/Cu impedance match EOS measurement target

The fabrication process of Al/Cu impedance-match EOS measurement target was discussed. With the rolling and diffusion-bonding technologies, the Al/Cu impedance-match EOS measurement target was successfully fabricated. The structure and surface roughness of the target were analyzed by AFM, SEM, XRD, and alpha-step 500 device. The surface roughness of the target is smaller than 25 nm. And the Al/Cu diffusion interface zone is narrower than 150 nm.