Soft X-ray projection lithography is expected as a candidate for VLSI production in the near future. Based on such background, soft X-ray projection lithography (SXPL) technology is being extensively studied in several countries, especially in Japan and USA, which are the main offers of microelectronic integrated circuits and its fabrication facilities. Those researches have made important progress in the major areas of SXPL, like debris free laser produced plasma source, design of high resolution and large field projection system, super precision mirror/substrate polishing and coating, low defect reflective masks, surface-imaging resist, and super fine scan stage, etc. Along the same thought, therefore, the authors and their colleagues have concentrated in SXPL researches in the recent ye