Multiplayer bonding technique for high power diode laser package

The bonding technique of high power diode laser package is studied and the method of making indium solder with evaporating deposition in high vacuum is mastered. The multiplayer bonding experiment is carried out without scaling powder. The performances of packaged CW and QCW lasers are measured. The experiment's results show that multilayer bonding technique with indium and InSn alloy for laser package is practical.