Micro-channel heatsink module for high power diode laser

Structural parameter of micro-channel heatsink is optimized through numerical calculation. Heat resistances of 4 different structural micro-channel heatsinks are measured by experiment. In order to take advantage of copper's high thermal conductivity, and W-Cu alloy's high hardness, micro-channel heatsink module is made by compound Cu-WCu layers. With an exterior size of 25.0 mm×12.0 mm×1.5 mm and heat resistance of 0.4～0.8 K/W, the optimized micro-channel heatsink module can match the need of thermal spread for high power diode laser with pulse power 120 W(duty cycle 20%) or continual power 50W, and can be used to package two-dimension high cycle duty or continual diode laser.