Thermal analysis of assembly and non-assembly cathodes

This paper compares the temperature distribution and warm up time between assembly cathode heated up by conduction and non-assembly cathode heated by radiation using the thermal analysis module of ANSYS. The results show that both of them have a uniform cathode surface temperature distribution and the temperature difference at the sleeve of assembly cathode is in proportion to the input power of its heater and that compared with the non-assembly cathode, the temperature of assembly cathode is higher at the sleeve and the cathode surface, but markedly lower at the heater. Nevertheless, non-assembly cathode starts faster; moreover, improving the emissivities of the cathode’s undersurface and the heater enables the non-assembly cathode to have thermal performance similar to that of the assem