Mechanical properties of YbF3 thin film deposited by thermal evaporation

The stress and adhesion of YbF3 thin film deposited by thermal evaporation have been investigated. The stresses of singlelayer YbF3 thin films at different technical conditions have been evaluated by using a Veeco interferometer. In our experiment, residual stress of YbF3 thin film is tensile. Thermal stress seems to be the main contribution to the residual stress. Deposition method affects the stress of thin film. The stress relaxation is observed in air. The stress of YbF3 thin film increases after heat treatment．