Vacuum diffusion bonding technology of aluminum/copper films

According to the requirement of the ICF experiments, the vacuum diffusion bonding of the aluminum and copper films were studied in high temperature circumstances(250℃). The microstructures of the joint and surface roughness are analyzed by means of SEM, XRD and an alpha-step device. The results show that the force among atoms, metallurgy combination and interface reaction are important to obtain the high quality joint of the aluminum and copper films.