Design of high efficient copper micro-channels cooler for diode laser

The thermal resistance of copper micro-channels cooler was analyzed, and a stackable copper micro-channels cooler with five layers was designed in this paper. The line cutting is adoted in the cooler process, the channel of each layer is 0.2mm wide and 0.3mm deep, the layers are assembled with vacuum solder, the thermal resistance of the cooler for DL with the cavity length of 0.6mm and width of 10mm is measured as 0.58℃/W. It was proved by experiment that the cooler was suitable for DL package with 10% duty cycle work．