Abstract: In order to overcome the randomness, abrasive waste and hydration layer of free abrasive polishing, a technology of bounded abrasive polishing for fused silica glass under anhydrous environment is proposed. A stable polishing wheel sintering process has been developed and applied to the polishing of fused silica glass. EDS energy spectrum analysis and XRD analysis of the processed products and the polishing wheel powder are carried out. The removal mechanism of consolidation abrasive polishing is preliminarily elaborated, and the effect of pressure and speed on the removal efficiency and surface roughness is explored from the macroscopic point of view. The experimental results show that: in the process, under normal force and shear force, the CeO₂ abrasive reacts with the fused silica, CeO₂ will bring SiO₂ out of the glass, thus to achieve material removal; at the same time, influence of pressure and rotating speed on the processing efficiency does not follow the Preston formula, temperature rise and chip removal of the polishing wheel are the key factors determining the efficiency of removal.