基于波形测试的异质结双极型晶体管器件负载失配影响分析

Load mismatch effects to heterojunction bipolar transistor device based on waveform measurement

  • 摘要: 大功率电磁脉冲冲击下,射频集成微系统内部容易产生负载失配问题,严重者可能导致系统失效甚至损毁。采用实时的波形测试方法,对射频器件的负载失配进而导致器件损毁的机理进行了分析。该方法以矢量网络分析仪作为主要测试仪器,结合回波信号注入和相位参考模块获得待测器件实时电压电流波形,进而分析其负载失配影响机制。采用有源负载牵引技术模拟大功率耦合电磁脉冲注入,进行了电压驻波比39∶1的失配测试,大幅提升了测试范围。创新性地采用了谐波信号源注入模拟杂散谐波电磁干扰,评估器件的谐波阻抗失配特性。通过实际异质结双极型晶体管(HBT)器件测试的结果表明,基波的失配会造成负载端电压过大,增加器件的易损性;基波和谐波频率的干扰分量组合使得输出电压瞬态峰值升高,造成器件的损毁。在进行电磁安全防护时,应同时考虑基波和谐波频率的防护。

     

    Abstract: Under the impact of high-power electromagnetic pulses, RF integrated microsystems are prone to generate load mismatch, which may lead to system failure or even damage. Based on a real-time waveform test method, this paper analyzes the mechanism of load mismatch of RF devices leading to device damage. This method utilizes vector network analyzer as the main instrument, obtaining the real-time voltage and current waveforms with reflection signal and phase reference module. Active load-pull technique is used to simulate high power coupled electromagnetic pulse injection and ruggedness test under 39∶1 VSWR is done. Furthermore, harmonic source injection is newly applied to simulate the electromagnetic interference caused by harmonics, obtaining the harmonic impedance mismatch characteristics of the device. The test results of actual heterojunction bipolar transistor device indicate that the combination of fundamental and harmonic interference components causes the transient peak value of the output voltage to be higher, which is more likely to damage the device. Hence the fundamental and harmonic components should be considered when conducting electromagnetic protection.

     

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