Background High power microwave devices play a critical role in modern scientific and technological fields, and their development has attracted widespread attention. In recent years, remarkable progess has been made in the global technologies of high-power microwave devices. However, the accompanying thermal management issues have become increasingly prominent. At present, the heat dissipation efficiency of related systems is lower than 75%.

Purpose In the future, their heat dissipation requirements will reach the kilowatt level per square centimeter, while the heat dissipation capacity of traditional air cooling methods is less than the hundred-watt level per square centimeter, which cannot meet such heat dissipation demands. Therefore, liquid cooling heat dissipation technology based on micro-channels will be an important research direction to solve thermal control problems of these devices.

Methods This paper proposes an embedded microchannel multi-layer substrate structure adopting gas-liquid two-phase flow heat dissipation technology.

Results The proposed structure enables chips to operate normally when the heat flux of packaged liquid cooling channels exceeds 1 kW/cm².

Conclusions Specimens were fabricated, and a combined approach of numerical simulation and experimental verification was adopted to validate the feasibility of the proposed scheme. This research offers a thermal management solution for microsystems and lays a foundation for its engineering implementation.