Abstract: Diode laser array curvature “smile” produced in the packaging process affects the lasering characteristics, life and beam quality of lasers. Using uniaxial amplification system composed of a high-resolution CCD, a fast axis collimation lens and cylindrical lenses, via laser emitters imaging and facula intensity-based centroid algorithm, the “smile” of diode laser array is measured. The experimental results show that: in the vicinity of threshold current, “smile” of the diode laser array with In solder is less than 2 μm. Influences of FAC lens and CCD resolution on the results are analyzed.