Abstract: With the rapid development of high-power lasers and electronic technology, higher requirements have been proposed for the structure and material of the heat sink device. Based on the principle of conduction-insulation heat, alternating stack epoxy resin composites with excellent thermal protection were prepared, the hexagonal boron nitride (h-BN: 5%, 15%, 25%) and expanded vermiculite (E-ver: 1%) are used as fillers for heat dissipation layer and thermal insulation layer, respectively. The thermal protection performance experiment was completed. The result shows that the temperature of the top center is 13−16 °C lower than that of the traditional materials, and the thermal delay time is greatly improved. An increase in the h-BN content causes an increase in the thermal protection properties of the composites. The thermal mechanism of the anisotropic stacked composites was explained.