Abstract:
									 Background As the low-altitude economy industry accelerates, low-altitude security has attracted increasing attention. High-power microwave (HPM) is one of the important means to address the security threats posed by non-cooperative unmanned aerial vehicles (UAVs). 
 Purpose As a type of high-power electromagnetic pulse, ultra-wideband high-power microwave (UWB-HPM) can attack the electronic information systems of non-cooperative UAVs through "front-door" or "back-door" coupling, resulting in effects such as interference, disruption, damage, and burnout.
 Methods We propose a new concept of o high-power microwave on wafer (HPM on-wafer), which integrate energy storage capacitors, high-power optically controlled semiconductor switches, and antennas on a single semiconductor wafer with thickness of 0.5 mm and diameter of 0.15 m.
 Results The unit of HPM on-wafer achieves an ultra-wideband high-power microwave output with a radiation factor of 20 kV. 
 Conclusions Experiments show that based on this integrated HPM on-wafer unit, the communication link of a consumer-grade UAV at a distance of 10 m is cut off and the UAV loses flight control. By arranging and combining the basic units of HPM on wafer, modular expansion can be realized to form ultra-wideband high-power microwave systems of different scales, which can meet the requirement of achieving the intended strike effect on different platforms.