石英真空窗薄膜金属化及封接技术研究

唐青; 刘鲁伟; 李炜; 余强; 孙文通; 王锴

doi:10.11884/HPLPB202638.250270

石英真空窗薄膜金属化及封接技术研究

doi: 10.11884/HPLPB202638.250270

唐青¹,
刘鲁伟^{1, 3,},
李炜^1, ,,
余强¹,
孙文通¹,
王锴²

1.
安徽工程大学集成电路学院，安徽芜湖 241000
2.
国防科技大学电子对抗学院电子制约技术安徽省重点实验室，合肥 230037
3.
电子科技大学电子科学与工程学院，成都 611731

基金项目: 电子制约技术安徽省重点实验室基金项目(ERKL2023KF01)；空间微波技术国家重点实验室开放基金项目（HTKJ2023KLKL504007) 安徽工程大学科研启动基金(2022YQQ054、2023YQQ020),大学生创新训练项目(S202410363211,202410363129)

详细信息

作者简介:
刘鲁伟，lwliu@ahpu.edu.cn

通讯作者:
李　炜，liwei@ahpu.edu.cn。

中图分类号: TN15
计量
- 文章访问数: 8
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- PDF下载量: 1
- 被引次数: 0
出版历程
- 收稿日期: 2025-08-26
- 修回日期: 2026-01-04
- 录用日期: 2025-12-22
- 网络出版日期: 2026-01-16

Metalization and sealing technology of quartz vacuum window film

Tang Qing¹,
Liu Luwei^{1, 3
,},
Li Wei^{1
, ,},
Yu Qiang¹,
Sun Wentong¹,
Wang Kai²

1.
School of Integrated Circuits, Anhui Polytechnic University, Wuhu 241000, China
2.
Key Laboratory of Electronic Restriction Technology, School of Electronic Warfare, National University of Defense Technology, Hefei 230037, China
3.
School of Electronic Science and Engineering, University of Electronic Science and Technology of China, Chengdu 611731, China

摘要

摘要: 面向超高真空精密光学系统的迫切需求，对高性能石英真空窗的封接技术展开系统性研究。石英虽具备优异透光性，但其与金属封接时因热膨胀系数差异较大导致的界面应力集中与真空密封失效，一直是制约低漏率石英真空窗制备的关键技术瓶颈。针对这一难题，提出采用磁控溅射技术在石英焊接面依次沉积Ti/Mo/Cu/Ag多层膜系，构建具有热应力缓冲能力的梯度功能金属化层，实现了石英表面的有效金属化。扫描电镜观察表明，所制备膜层连续致密、结构均匀；纳米压痕实验进一步测得金属化层与石英基底的结合强度约为3.83 N，表明膜层附着牢固可靠。实验结果表明：基于该金属化方案所制备的真空窗口组件，其漏率低于10⁻¹² Pa·L/s。该成果可广泛应用于同步辐射、量子测量及空间探测等领域，为高性能真空器件的发展提供了关键技术支撑。
- 石英 /
- 真空钎焊 /
- 磁控溅射 /
- 真空窗 /
- 光电子器件
Abstract: Background
Although quartz exhibits excellent light transmittance, the significant difference in thermal expansion coefficients between quartz and metal sealing materials has long been a critical technical bottleneck, leading to interface stress concentration and vacuum sealing failures in low-leakage quartz windows.
Purpose
This study addresses the urgent demand for ultra-high vacuum precision optical systems by conducting systematic research on sealing technologies for high-performance quartz vacuum windows.
Methods
To overcome this challenge, this paper innovatively proposes using magnetron sputtering technology to sequentially deposit a Ti/Mo/Cu/Ag multilayer film system on the quartz welding surface, creating a gradient functional metallization layer with thermal stress buffering capability that achieves effective surface metallization..
Results
Scanning electron microscopy observations revealed continuous, dense, and structurally uniform film layers.Nanoindentation experiments further demonstrated a bonding strength of approximately 3.83N between the metallized layer and quartz substrate, indicating robust adhesion. Experimental results show that vacuum window components fabricated using this metallization scheme achieve leakage rates below 10⁻¹² mbar·L⁻¹.
Conclusions
This achievement has broad applications in synchrotron radiation, quantum measurement, and space exploration, providing crucial technical support for the development of high-performance vacuum devices.
- quartz glass /
- vacuum brazing /
- magnetron sputtering /
- vacuum window /
- optoelectronic devices

HTML全文

图 1 斜靶磁控溅射镀膜示意图

Figure 1. Schematic diagram of inclined target magnetron sputtering coating

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图 2 膜层表面形貌图

Figure 2. Surface morphology of the membrane layer

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图 3 EDS分层图

Figure 3. EDS layered image

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图 4 元素分布总数谱图

Figure 4. Total element distribution spectrum

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图 5 磁控溅射后Ag膜层照片、电镀后Ni膜层照片及磁控溅射膜层的SEM成象图

Figure 5. Photo of Ag film layer after magnetron sputtering, Ni film layer after electroplating and SEM image of magnetron sputtering film layer

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图 6 划痕形貌图

Figure 6. Scratch morphology

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图 7 切向力-声发射与划痕长度曲线

Figure 7. Tensile force-acoustic emission and scratch length curves

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图 8 真空窗模型

Figure 8. vacuum window model

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图 9 真空窗实物

Figure 9. vacuum window

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图 10 漏气率测试

Figure 10. Leakage rate test

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表 1 各层材料的物理参数

Table 1. Physical parameters of materials

material	hermal expansivity/℃	coefficient of heat conduction/(W^·m^−1·K⁻¹)	Young modulus/ GPa
quartz glass	0.59×10⁻⁶	1.8	70
Ti	10.5×10⁻⁶	20	70
Mo	5.8×10⁻⁶	95	245
Cu	19.5×10⁻⁶	90	30
Ag	22.5×10⁻⁶	100	15

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