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脉冲晶闸管微观接触界面电热特性表征模型与验证

刘毅 曾臣乾 李柳霞 肖诗芸 林福昌

刘毅, 曾臣乾, 李柳霞, 等. 脉冲晶闸管微观接触界面电热特性表征模型与验证[J]. 强激光与粒子束. doi: 10.11884/HPLPB202638.250495
引用本文: 刘毅, 曾臣乾, 李柳霞, 等. 脉冲晶闸管微观接触界面电热特性表征模型与验证[J]. 强激光与粒子束. doi: 10.11884/HPLPB202638.250495
Liu Yi, Zeng Chenqian, Li Liuxia, et al. Electrothermal characterization model for the micro-contact interface of pulse thyristors[J]. High Power Laser and Particle Beams. doi: 10.11884/HPLPB202638.250495
Citation: Liu Yi, Zeng Chenqian, Li Liuxia, et al. Electrothermal characterization model for the micro-contact interface of pulse thyristors[J]. High Power Laser and Particle Beams. doi: 10.11884/HPLPB202638.250495

脉冲晶闸管微观接触界面电热特性表征模型与验证

doi: 10.11884/HPLPB202638.250495
基金项目: 湖北省杰出青年科学基金项目(2024AFA046)
详细信息
    作者简介:

    刘 毅,yiliu@hust.edu.cn

    通讯作者:

    李柳霞,llx@hust.edu.cn

  • 中图分类号: TM832

Electrothermal characterization model for the micro-contact interface of pulse thyristors

  • 摘要: 脉冲晶闸管工作在强流脉冲工况,重复的电磁热力联合冲击会导致局部过温造成铝层电熔蚀、进而加速晶闸管热疲劳失效。针对由于接触界面电热效应产生的失效问题,综合考虑表面粗糙度、外施压力、电极图案和载流子扩散等因素,建立了脉冲晶闸管微观接触界面电热特性表征模型,并在脉冲工况下进行了仿真模拟。设计了晶闸管电熔蚀加速老化试验验证仿真的正确性,在重复放电140次时,开关阳极表面外圈出现明显铝层熔蚀现象;当放电次数达到400次时,硅坑在更靠近门极位置出现。试验结果证明了模型对电熔蚀失效规律的预测精度,为脉冲晶闸管电熔蚀失效的定量评估提供了可靠技术支撑。
  • 图  1  脉冲晶闸管微观接触界面电热特性表征模型建模思路

    Figure  1.  Approach for electrothermal characterization model for the micro-contact interface of pulse thyristors

    图  2  脉冲晶闸管实物及压力分布仿真模型

    Figure  2.  Pulse thyristor physical model and pressure distribution simulation model

    图  3  接触面及单个接触斑点示意图

    Figure  3.  Schematic diagram of the contact interface and a single contact spot

    图  5  接触斑点传热模型

    Figure  5.  Contact spot heat transfer model

    图  6  脉冲晶闸管结构图

    Figure  6.  Schematic structure of pulse thyristor

    图  7  建立的晶闸管半导体器件模型

    Figure  7.  The established thyristor semiconductor physical model

    图  8  阻断特性验证

    Figure  8.  Verification of blocking characteristics

    图  9  压力分布仿真结果

    Figure  9.  Pressure distribution simulation results

    图  4  接触斑点参数计算流程

    Figure  4.  Calculation process for contact spot parameters

    图  10  场-路耦合仿真电路及结果

    Figure  10.  Field-circuit coupling simulation circuit and results

    图  11  接触斑点热特性仿真结果

    Figure  11.  Simulation results of the thermal characteristics of contact spots

    图  12  试验回路及结果

    Figure  12.  Experimental circuit and results

    表  1  压力分布模型各组件材料

    Table  1.   Materials for each component of the pressure distribution model

    No. name materials
    1 gasket 304 stainless steel
    2 clamping plate 7075 aluminum alloy
    3 shim 45 steel
    4 simplified assembly copper
    5 pulse thyristor Silicon, molybdenum, copper
    下载: 导出CSV

    表  2  部分技术参数

    Table  2.   Partial technical parameters

    repetitive peak off-state voltage VDRM/V critical rate of rise of off-state voltage (dv/dt)/(V·μs−1) gate trigger current IGT/mA
    56006500 2000 40
    下载: 导出CSV

    表  3  接触面材料物理参数

    Table  3.   Physical parameters of the contact surface material

    material Poisson’s
    ratio
    elastic modulus/
    GPa
    resistivity/
    (Ω·m)
    specific heat capacity/
    (J·kg−3·K−3)
    density/(kg·m−3) melting point/℃
    aluminum 0.33 71.7 2.7×10−9 900 2690 660
    silicon 0.28 190 1.9×10−3 700 2329 1410
    molybdenum 0.32 320 5.2×10−9 242.8 10200 2620
    下载: 导出CSV

    表  4  接触斑点尺寸参数

    Table  4.   Contact spot size parameter

    contact spot number pressure/(N·m−2) base radius of the micro-unit/μm a/μm d/μm
    #1 2.2×106 136.8 2.5 1.41
    #2 8.3×106 87.1 3.0 1.06
    #3 4.5×106 105.1 2.7 1.22
    #4 2.5×106 133.2 2.6 1.38
    下载: 导出CSV
  • [1] 张星汝, 冯冰洋, 刘俊, 等. 高电压大电流晶闸管组件的热特性[J]. 强激光与粒子束, 2020, 32: 025016 doi: 10.11884/HPLPB202032.190346

    Zhang Xingru, Feng Bingyang, Liu Jun, et al. Thermal characteristics of high voltage and high current thyristor assembly[J]. High Power Laser and Particle Beams, 2020, 32: 025016 doi: 10.11884/HPLPB202032.190346
    [2] Liu Yi, Lin Fuchang, Dai Ling, et al. Development of a compact 450-kJ pulsed-power-supply system for electromagnetic launcher[J]. IEEE Transactions on Plasma Science, 2011, 39(1): 304-309. doi: 10.1109/TPS.2010.2050339
    [3] Taylor P D. 晶闸管的设计与制造[M]. 庞银锁, 译. 北京: 中国铁道出版社, 1992

    Taylor P D. Thyristor design and realization[M]. Pang Yinsuo, trans. Beijing: China Railway Publishing House, 1992
    [4] 缪云欣. 脉冲晶闸管型强流开关电熔蚀失效特性研究[D]. 武汉: 华中科技大学, 2024

    Miao Yunxin. Research on failure characteristics due to electrical melting erosion in heavy current switches based on pulse thyristor[D]. Wuhan: Huazhong University of Science and Technology, 2024
    [5] 李辉, 余越, 姚然, 等. 基于多层级模拟的压接型IGBT器件短路失效机理分析[J]. 中国电机工程学报, 2023, 43(6): 2392-2403 doi: 10.13334/j.0258-8013.pcsee.212815

    Li Hui, Yu Yue, Yao Ran, et al. Study on the short circuit failure mechanism of press pack IGBT device based on multi-level simulation[J]. Proceedings of the CSEE, 2023, 43(6): 2392-2403 doi: 10.13334/j.0258-8013.pcsee.212815
    [6] Xiao Shiyun, Liu Yi, Li Liuxia, et al. Research on the mechanism of electrical erosion accelerating failure in high-current pulse thyristor-based switches[J]. IEEE Transactions on Device and Materials Reliability, 2025, 25(2): 263-273. doi: 10.1109/TDMR.2025.3565618
    [7] Greenwood J A, Tripp J H. The contact of two nominally flat rough surfaces[J]. Proceedings of the Institution of Mechanical Engineers, 1970, 185(1): 625-633. doi: 10.1243/PIME_PROC_1970_185_069_02
    [8] Hsieh C K. A critical evaluation of surface geometrical parameters for a nominally flat surface model[J]. Journal of Lubrication Technology, 1974, 96(4): 638-639. doi: 10.1115/1.3452512
    [9] 张西应, 曾文彬, 操国宏, 等. 大功率晶闸管器件加速老化试验和寿命预测方法研究[J]. 电子质量, 2022(5): 64-68 doi: 10.3969/j.issn.1003-0107.2022.05.015

    Zhang Xiying, Zeng Wenbin, Cao Guohong, et al. Research on accelerated aging test and life prediction methods of power thyristor device[J]. Electronics Quality, 2022(5): 64-68 doi: 10.3969/j.issn.1003-0107.2022.05.015
    [10] 程礼椿. 电接触理论及应用[M]. 北京: 机械工业出版社, 1988

    Cheng Lichun. Theory and applications of electrical contacts[M]. Beijing: Mechanical Industry Press, 1988
    [11] Baliga B J. Fundamentals of power semiconductor devices[M]. Cham: Springer, 2008.
    [12] Klaassen D B M. A unified mobility model for device simulation—II. Temperature dependence of carrier mobility and lifetime[J]. Solid-State Electronics, 1992, 35(7): 961-967. doi: 10.1016/0038-1101(92)90326-8
    [13] Caughey D M, Thomas R E. Carrier mobilities in silicon empirically related to doping and field[J]. Proceedings of the IEEE, 1967, 55(12): 2192-2193. doi: 10.1109/PROC.1967.6123
    [14] Klaassen D B M, Slotboom J W, de Graaff H C. Unified apparent bandgap narrowing in n-and p-type silicon[J]. Solid-State Electronics, 1992, 35(2): 125-129. doi: 10.1016/0038-1101(92)90051-D
    [15] Yu Ruixing, Nazarov A N, Lysenko V S, et al. Impact ionization induced dynamic floating body effect in junctionless transistors[J]. Solid-State Electronics, 2013, 90: 28-33. doi: 10.1016/j.sse.2013.02.056
    [16] Kumari V, Modi N, Saxena M, et al. Modeling and simulation of double gate junctionless transistor considering fringing field effects[J]. Solid-State Electronics, 2015, 107: 20-29. doi: 10.1016/j.sse.2015.01.020
    [17] Ahmeda K, Ubochi B, Benbakhti B, et al. Role of self-heating and polarization in AlGaN/GaN-based heterostructures[J]. IEEE Access, 2017, 5: 20946-20952. doi: 10.1109/ACCESS.2017.2755984
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出版历程
  • 收稿日期:  2025-12-30
  • 修回日期:  2026-03-16
  • 录用日期:  2026-03-12
  • 网络出版日期:  2026-04-13

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